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 ICX075AK
Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for Color Video Cameras
Description The ICX075AK is a diagonal 8mm (Type 1/2) interline CCD solid-state image sensor with a square pixel array. Progressive scan allows all pixels signals to be output independently within approximately 1/50 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High resolution and high color reproductivity are achieved through the use of R, G, B primary color mosaic filters. Further, high sensitivity and low dark current are achieved through the adoption of HAD (HoleAccumulation Diode) sensors. This chip is suitable for image input and processing applications.
V
22 pin DIP (Cer-DIP)
Pin 1 2
Features * Progressive scan allows individual readout of the image signals from all pixels. * High vertical resolution (580TV-lines) still picture without a mechanical shutter. * Square pixel unit cell * R, G, B primary color mosaic filters on chip * High resolution, high color reproductivity, high sensitivity, low dark current * Continuous variable-speed shutter * Low smear * Excellent antiblooming characteristics * Reset gate: 5V drive (bias: no adjustment) Device Structure * Image size: * Number of effective pixels: * Total number of pixels: * Interline CCD image sensor * Chip size: * Unit cell size: * Optical black: * Number of dummy bits: * Substrate material:
8 3 Pin 12 H 38
Optical black position (Top View)
Diagonal 8mm (Type 1/2) 782 (H) x 582 (V) approx. 460K pixels 823 (H) x 592 (V) approx. 490K pixels 8.10mm (H) x 6.33mm (V) 8.3m (H) x 8.3m (V) Horizontal (H) direction: Front 3 pixels, rear 38 pixels Vertical (V) direction: Front 8 pixels, rear 2 pixels Horizontal 19 Vertical 5 Silicon
Wfine CCD is a registered trademark of Sony Corporation. Represents a CCD adopting progressive scan, primary color filter and square pixel. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E95706F99
ICX075AK
Block Diagram and Pin Configuration (Top View)
VHOLD VOUT2 CGG2 VOUT1 CGG1 GND V1 HIS
2
11
10
9
8
7
6
5
V2
4
3
G
B G B G B G
G R G R G R
B G B G B G Note)
Vertical Register
R G R G R
Horizontal Register 1 Horizontal Register 2
HIG1
1
V3
Note)
: Photo sensor
12
13
14
15
16
17
18
19
20
21
22
RG
POG
HHG1
Pin Description Pin No. Symbol 1 2 3 4 5 6 7 8 9 10 11 HIG1 HIS V3 V2 V1 VHOLD GND CGG1 VOUT1 CGG2 VOUT2 Test pin 2 Test pin 2 Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register final stage accumulation clock GND Output amplifier 1 gate 1 decoupling capacitor Signal output 1 Output amplifier 2 gate 1 decoupling capacitor Signal output 2 Description Pin No. Symbol 12 13 14 15 16 17 18 19 20 21 22 VDD RG VL SUB H1 H2 HHG1 HHG2 HIG2 POG VOG Description Supply voltage Reset gate clock Protective transistor bias Substrate (overflow drain) Horizontal register transfer clock Horizontal register transfer clock Inter-horizontal register transfer clock Inter-horizontal register transfer clock Test pin 2 Test pin 2 Vertical register final stage transfer clock
1 DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1F or more. 2 Regarding the test pins: apply the same voltage as the supply voltage to HIS, and ground HIG1, HIG2, and POG.
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HHG2
VOG
HIG2
SUB
VDD
H1
H2
VL
ICX075AK
Absolute Maximum Ratings Item Substrate voltage SUB - GND Supply voltage VDD, VOUT1, VOUT2, HIS, CGG1, CGG2 - GND VDD, VOUT1, VOUT2, HIS, CGG1, CGG2 - SUB V1, V2, V3, VHOLD, VOG - GND V1, V2, V3, VHOLD, VOG - SUB Ratings -0.3 to +55 -0.3 to +18 -55 to +10 -15 to +20 to +10 to +15 to +17 -17 to +17 -10 to +15 -55 to +10 -65 to +0.3 -0.3 to +27.5 -0.3 to +22.5 -0.3 to +17.5 -30 to +80 -10 to +60 Unit V V V V V V V V V V V V V V C C 1 Remarks
Clock input voltage
Voltage difference between vertical clock input pins Voltage difference between horizontal clock input pins H1, H2 - VOG H1, H2 - GND H1, H2 - SUB VL - SUB V2, V3, VDD, VOUT1, VOUT2, HIS, HIG1, HIG2, POG - VL RG - GND V1, CGG1, CGG2, H1, H2, HHG1, HHG2, VOG, VHOLD - VL Storage temperature Operating temperature 1 +27V (Max.) when clock width < 10s, clock duty factor < 0.1%.
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ICX075AK
Bias Conditions Item Supply voltage Substrate voltage adjustment range Substrate voltage adjustment precision Protective transistor bias VL Symbol VDD VSUB Min. 14.55 9.0 Indicated voltage - 0.1 Indicated voltage 2 Typ. 15.0 Max. 15.45 18.5 Indicated voltage + 0.1 Unit Remarks V V V 1
DC Characteristics Item Supply current Input current Input current Symbol IDD IIN1 IIN2 Min. Typ. 10 1 10 Max. Unit mA A A 3 4 Remarks
1 Indications of substrate voltage (VSUB) setting value The setting value of the substrate voltage is indicated on the back of image sensor by a special code. Adjust the substrate voltage (VSUB) to the indicated voltage. VSUB code -- two characters indication Integer portion Decimal portion The integer portion of the code and the actual value correspond to each other as follows. Integer portion of code Value 9 9 A C d E f G h J K
10 11 12 13 14 15 16 17 18
"A5" VSUB = 10.5V. 2 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. 3 (1) Current to each pin when 18V is applied to VDD, VOUT1, VOUT2, HIS, RG, CGG1, CGG2, GND and SUB pins, while all pins that are not tested are grounded. (2) Current to each pin when 20V is applied sequentially to V1, V2 and V3 pins, while all pins that are not tested are grounded. However, 20V is applied to SUB pin. (3) Current to each pin when 15V is applied sequentially to RG, H1 and H2 pins, while all pins that are not tested are grounded. However, 15V is applied to SUB pin. (4) Current to VL pin when 25V is applied to V2, V3, POG, HIG1, HIG2, VDD, VOUT1 and VOUT2 pins or when, 15V is applied to V1, VHOLD, VOG, CGG1, CGG2, H1, H2, HHG1 and HHG2 pins, while VL pin is grounded. However, GND and SUB pins are left open. (5) Current to GND pin when 20V is applied to the RG pin and the GND pin is grounded. 4 Current to SUB pin when 55V is applied to SUB pin, while pins that are not tested are grounded.
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ICX075AK
Clock Voltage Conditions Item Readout clock voltage VVT VVH02 VVH1, VVH2, VVH3 VVL1, VVL2, VVL3 VV Vertical transfer clock voltage I VVL1 - VVL3 I VVHH VVHL VVLH VVLL Horizontal transfer clock voltage VH VHL VRG Reset gate clock voltage VRGLH - VRGLL VRGH Substrate clock voltage VSUB Vertical final stage accumulation clock voltage transfer clock voltage VVHOLDH, VVOGH VVHOLDL, VVOGL VDD +0.4 21.5 -0.05 -8.0 4.75 -8.0 -0.05 VDD +0.6 22.5 0 -7.5 5.0 -7.5 0 4.75 -0.05 4.5 5.0 0 5.0 Symbol Min. 14.55 -0.05 -0.2 -8.0 6.8 Typ. 15.0 0 0 -7.5 7.5 Max. 15.45 0.05 0.05 -7.0 8.05 0.1 0.5 0.5 0.5 0.5 5.25 0.05 5.5 0.8 VDD +0.8 23.5 0.05 -7.0 5.25 -7.0 0.05 Unit V V V V V V V V V V V V V V V V V V V V V Waveform diagram 1 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 6 6 7 7 7 Input through 0.01F capacitance Low-level coupling High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL01 + VVL03)/2 VV = VVHn - VVLn (n = 1 to 3) VVH = VVH02 Remarks
VHHG1H, VHHG2H Inter-horizontal register VHHG1L, VHHG2L transfer clock voltage VHHG1M, VHHG2M
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ICX075AK
Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Symbol CV1 CV2 CV3 CV12 Capacitance between vertical transfer clocks Capacitance between vertical final stage accumulation clock and GND Capacitance between vertical final stage transfer clock and GND Capacitance between inter-horizontal register transfer clock and GND Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor CV23 CV31 CVHOLD CVOG CHHG1 CHHG2 CH1 CH2 CHH CRG CSUB R1, R2, R3 RGND RH1 RH2 Min. Typ. 820 820 820 3300 2200 2200 19 12 19 19 68 68 47 10 400 22 15 24 24 Max. Unit Remarks pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF
V1
R1
CV12 CV1 RGND CV2
R2
V2
RH1 H1 CHH
RH2 H2
Cv31
CV3
Cv23 CH1 CH2
R3 V3
Vertical transfer clock equivalent circuit
Horizontal transfer clock equivalent circuit
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ICX075AK
Drive Clock Waveform Conditions (1) Readout clock waveform
100% 90%
II II
M M 2 tf 0V
VVT 10% 0% tr twh
(2) Vertical transfer clock waveform
V1 VVHL VVH1 VVHH VVHL VVH1 VVHH VVH
VVLH VVL01 VVL1 VVLL V2 VVH02 VVHH VVHL VVH2 VVL1 VVLL
VVLH VVL
VVHH VVHL
VVH2
VVH
VVLH VVL2 VVLL V3 VVHL VVH3 VVL2 VVLL
VVLH VVL
VVHH VVHL
VVH3
VVHH
VVH
VVLH VVL03 VVLL VVH = VVH02 VVL = (VVL01 + VVL03)/2 VVLH VVL3 VVLL VV1 = VVH1 - VVL01 VV2 = VVH02 - VVL2 VV3 = VVH3 - VVL03 VVL
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ICX075AK
(3) Horizontal transfer clock waveform
tr
twh
tf
90% VH 10% VHL
twl
(4) Reset gate clock waveform
tr twh tf VRGH twl RG waveform Point A VRG VRGLH VRGL VRGLL VRGL + 0.5V
H1 waveform 2.5V
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL (5) Substrate clock waveform
100% 90%
M VSUB 10% 0% M 2 tf
VSUB
tr
twh
-8-
ICX075AK
(6) Vertical final stage accumulation clock waveform * Vertical final stage transfer clock waveform
VHOLD, VOG tr tf
VVHOLDH, VVOGH 90%
10% VVHOLDL, VVOGL
(7) Inter-horizontal register transfer clock waveform
HHG1, HHG2 tr tf1 VHHG1H, VHHG2H 90% 90% tf2 10% VHHG1M, VHHG2M 90%
10%
10% VHHG1L, VHHG2L
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ICX075AK
Clock Switching Characteristics Item Readout clock Vertical transfer clock
Horizontal transfer clock
Symbol VT V1, V2, V3 H1 H2
twh
twl
tr
tf, tf1, tf2
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.3 2.5 0.4 15 18 21 23 26 21 18 26 23 10 17.5 10 0.01 0.01 11 14 49 2 0.4 20 20 20 20 20 20 20 20 15 0.1 400 10 17.5 10 0.01 0.01 2 0.4 15
Unit s ns
Remarks During readout 1 2
During imaging
ns s ns s ns ns ns ns
During parallel- H1 serial conversion H2 RG SUB
Reset gate clock Substrate clock
1.4 1.6
During drain charge
Vertical final stage VHOLD accumulation/ VOG transfer clock Inter-horizontal register transfer clock HHG1 HHG2
1 When vertical transfer clock driver CXD1268M is used. 2 tf tr - 2ns, and the cross-point voltage (VCR) for the H1 rising side of the H1 and H2 waveforms must be at least 2.5V.
two Item Horizontal transfer clock Symbol H1, H2 Min. Typ. Max. 24 29 Unit ns Remarks 3
3 The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two.
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ICX075AK
Image Sensor Characteristics Item G sensitivity Sensitivity comparison Saturation signal Smear Video signal shading Uniformity between video signal channels Dark signal Dark signal shading Lag R B Symbol Sg Rr Rb Vsat Sm SHg Srg Sbg Vdt Vdt Lag Min. 170 0.3 0.4 375 0.003 0.007 25 8 8 2 1 0.5 Typ. 250 0.45 0.55 0.6 0.7 mV % % % % mV mV % Max. Unit mV Measurement method 1 1 1 2 3 4 5 5 6 7 8
(Ta = 25C) Remarks
Ta = 60C
Zone 0
Ta = 60C Ta = 60C
Note) All the characteristic data of this image sensor was yielded when the sensor was operated in the 1/50s interlaced mode. Zone Definition of Video Signal Shading
782 (H) 6 6 2
582 (V)
Zone 0
2
Ignored region Effective pixel region
Measurement System
CCD signal output 1 [A] [C]
C.D.S
AMP
S/H
Signal output 1
CCD
[B] CCD signal output 2
C.D.S
AMP
S/H
[D]
Signal output 2
Note) Adjust the amplifier gain so that the gain between [A] and [C], and between [B] and [D] equals 1.
- 11 -
ICX075AK
Composition of color coding and output signal The color filters of this image sensor are arranged in the layout shown in the figure below. Gb B Gb B R Gr R Gr Gr and Gb denote the G signals on the same line as the R signal and the B signal, respectively.
Gb B Gb B R Gr R Gr
Readout modes The output methods for the two readout modes indicated below are now described. 1/50s interlaced
Gb R B Gr Gb R B Gr
1/25s non-interlaced
Odd field
VOUT1 VOUT2 Gb R B Gr
VOUT1 VOUT2
Even field
VOUT1 VOUT2
1. 1/50s interlaced In this mode, the signals are output in a 1/50s period using the two output pins (VOUT1, VOUT2). The signals from two adjacent horizontal lines are simultaneously output from the respective output pins. The lines output from the output pins are changed over with each field. The VOUT1 signal after it has passed through the CDS and other external circuits or the signal produced by adding the VOUT1 and VOUT2 signals accommodate interlaced scanning. In the Odd field, R signal and Gr signal are output from VOUT1 pin and Gb signal and B signal are output from VOUT2 pin. In the Even field, Gb signal and B signal are output from VOUT1 pin and R signal and Gr signal are output from VOUT2 pin. 2. 1/25s non-interlaced In this mode, the signals are output in a 1/25s period using only one output pin (VOUT1). Unlike the 1/50s interlaced mode described above, the external circuit can be simplified. The imaging characteristics also differ from those of the other modes. R signal and Gr signal lines and Gb signal and B signal lines are output sequentially from VOUT1 pin only.
- 12 -
ICX075AK
Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the substrate voltage is set to the value indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (OB) level is used as the reference for the signal output, which is taken as the value of the Gr/Gb signal output or R/B signal output of signal output 1 in the measurement system. 3) In the following measurements, this image sensor is operated in 1/50s interlaced mode. Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.00mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II : Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.00mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. G sensitivity, sensitivity comparison Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/100s, measure the signal outputs (VGr, VGb, VR and VB) at the center of each Gr, Gb, R and B channel screens, and substitute the values into the following formula. VG = (VGr + VGb)/2 Sg = VG x 100 [mV] 50 Rr = VR/VG Rb = VB/VG 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 20 times the intensity with the average value of the Gr signal output, 120mV, measure the minimum values of the Gr, Gb, R and B signal outputs. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the average value of the Gr signal output to 120mV. Measure the average values of the Gr signal output, Gb signal output, R signal output and B signal output (Gra, Gba, Ra and Ba), and then adjust the luminous intensity to 500 times the intensity with average value of the Gr signal output, 120mV. After the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (Sm1 [mV]) of signal output 1 and the maximum value (Sm2 [mV]) of signal output 2, and substitute the values into the following formula. Sm = Sm1 + Sm2 Gra + Gba + Ra + Ba 1 1 / x x x 100 [%] (1/10V method conversion value) 2 4 10 500 - 13 -
ICX075AK
4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the Gr signal output is 120mV. Then measure the maximum (Grmax [mV]) and minimum (Grmin [mV]) values of the Gr signal output and substitute the values into the following formula. SHg = (Grmax - Grmin)/120 x 100 [%] 5. Uniformity between video signal channels After measuring 4, measure the maximum (Rmax [mV]) and minimum (Rmin [mV]) values of R signal, and the maximum (Bmax [mV]) and minimum (Bmin [mV]) values of B signal. Substitute the values into the following formula. Srg = (Rmax - Rmin)/120 x 100 [%] Sbg = (Bmax - Bmin)/120 x 100 [%] 6. Dark signal Measure the average value of the signal output 1 (Vdt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 7. Dark signal shading After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output 1 and substitute the values into the following formula. Vdt = Vdmax - Vdmin [mV] 8. Lag Adjust the Gr signal output value generated by strobe light to 120mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/120) x 100 [%]
FLD
SG Light Strobe light timing Gr signal output 120mV Output Vlag (lag)
- 14 -
Drive Circuit
2SC2785 x 3
15V
56k 0.1 270k 47k 1/35V 1/35V 0.1 39 15k 27k 15k
-7.5V
22/16V
5V
13 12 11 22/20V 2SK523 1/10V 3.9k 1/10V 100
CXD1268M
22 /16V
20 19 18 17 N.C. 16 15 14 0.1
XV2 XSG
1 2 N.C. 3 4 5 6 7 N.C. 8 9 10
[A] CCD OUT1
XV1 XV3
10/20V 100k 1 2 3 4 5 6 7 8 9 10 11
100 2SK523 3.9k
18 1/35V 22/16V
HHG2 HHG1 H2 H1 SUB VL RG
XSUB XVHOLD XHHG1-1 XHHG1-2 XHHG2-1 XHHG2-2 XVOG ICX075 (BOTTOM VIEW)
VOG POG HIG2 VDD
17 16 15 14 13 12 11 22/10V 3.3/16V 100 22 21 20 19 18 17 16 15 14 13 12
1 2 3 4 5 6 7
CXD1250
8 9
V3 V2 V1 VHOLD GND CGG1 VOUT1 CGG2 VOUT2
20 19
HIG1 HIS
[B] CCD OUT2
- 15 -
1/20V HC04 HC04 0.01
22/10V
10
1M 3.3/20V 0.01
XH2
XH1
ICX075AK
RG
ICX075AK
Spectral Sensitivity Characteristics (Includes lens characteristics, excludes light source characteristics)
1 0.9 R 0.8 0.7 B G
Relative Response
0.6 0.5 0.4 0.3 0.2 0.1 0 400
500 Wave Length [nm]
600
700
Sensor Readout Clock Timing Chart
1/50s interlaced mode
HD
V1 Odd Field
V2 V3 43.25 V1 2.58 2.58 3.25
Even Field
V2 V3
Unit : s
- 16 -
Drive Timing Chart (Vertical Sync)
1/50s interlaced mode
FLD
VD
BLK
HD
625 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
V1
V2
V3
CCD OUT1 13571 35 7
582
581
CCD OUT2 24682468
581
SG
582
309 310 311 312 313 314 315 316 317 318 319 320 321 322 323 324 325 326 327 328 329 330
24682468
1 35 713 57
335
340
- 17 -
ICX075AK
Drive Timing Chart (Horizontal Sync)
1/50s interlaced mode
HD
BLK
CLK
V1
V2
V3
VOG
VHOLD
- 18 -
HHG1
HHG2
H1
H2
RG
SHP
SHD
ICX075AK
SUB
ICX075AK
Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.)
Upper ceramic
39N
29N
29N
0.9Nm
Lower ceramic
Low melting point glass Shearing strength Tensile strength Torsional strength
Compressive strength
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. - 19 -
ICX075AK
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) The upper and lower ceramic are joined by low melting point glass. Therefore, care should be taken not to perform the following actions as this may cause cracks. * Applying repeated bending stress to the outer leads. * Heating the outer leads for an extended period with a soldering iron. * Rapidly cooling or heating the package. * Applying any load or impact to a limited portion of the low melting point glass using tweezers or other sharp tools. * Prying at the upper or lower ceramic using the low melting point glass as a fulcrum. Note that the same cautions also apply when removing soldered products from boards. e) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions.
- 20 -
Package Outline
Unit: mm
22pin DIP (600mil)
0 to 9
9.0 12 22 12 A
0.7
22
3
C
15.24
B V H 2-R0.7
11.55
3
7.55
0.55
B' 14.6 3
1.27
4.0 0.3
- 21 -
0.7
0.3 0.46 0.3
M
3.4 0.3
1. "A" is the center of the effective image area. 2. The two points "B" of the package are the horizontal reference. The point "B'" of the package is the vertical reference. 3. The bottom "C" of the package is the height reference. 4. The center of the effective image area, relative to "B" and "B'" is (H, V) = (9.0, 7.55) 0.15mm. 5. The rotation angle of the effective image area relative to H and V is 1. 6. The height from the bottom "C" to the effective image area is 1.41 0.15mm. 7. The tilt of the effective image area relative to the bottom "C" is less than 60m. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. The notches on the bottom must not be used for reference of fixing.
0.69 (For the 1st. pin only) 1.27
PACKAGE STRUCTURE
PACKAGE MATERIAL
Cer-DIP
LEAD TREATMENT
TIN PLATING
LEAD MATERIAL
42 ALLOY
ICX075AK
PACKAGE WEIGHT
2.6g
0.25
1 18.0 0.4 17.6 11
11
15.1 0.3
1


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